| PRODUCT |
SIZES |
CHARACTERISTICS |
FEATURES |
APPLICATIONS |
SM-730- (TG130) Regular FR-4 Laminate and Prepreg Copper Foil: .05 oz to 6.0 oz ( or .018mm to .204 mm)
Thickness 3 mil to 125 mil ( or .08 mm to 3.20 mm) |
36 x 48
40 x 48
42 x 48
|
Tetra – Functional Exposy
E-Woven Glass
HTE Or RTF Copper |
UV Block and AOI Performance.
Excellent dimensional stability and thickness uniformity.
Superior thermal and chemical resistance. Excellent electrical and mechanical properties.
|
Computer and Peripheral
Communications
Consumer Instrumentation
OA Equipment, etch |
SM750 (TG150)
Lead Free Mid TG Laminate and Prepreg
Copper Foil : .05 oz to 6.0 oz ( or .018 mm to .204 mm )
Thickness: 3 mil to 93 mil or (.08 mm to 2.35 mm) |
36 x 48
40 x 48
42 x 48 |
Multifunctional Epoxy
E-Woven Glass
HTE Or RTF Copper |
UV Block and AOI Performance
Excellent dimensional stability and thickness uniformity.
Superior thermal and chemical resistance. Excellent electrical and mechanical properties
Lead Free Soldering process suitable (TG150 deg C Laminate) |
Computer and Peripheral
Communications
Instrumentation
OA Equipment, etch |
SM750 (TG170)Lead Free high TG Laminate and Prepreg
Copper Foil: .05 oz to 6.0 oz ( or .018mm to .204 mm)
Thickness 3 mil to 93 mil ( or .08 mm to 2.35 mm) |
36 x 48
40 x 48
42 x 48 |
Multifunctional Epoxy
E-Woven Glass
HTE Or RTF Copper |
UV Block and AOI Performance
Excellent dimensional stability and thickness uniformity.
Superior thermal and chemical resistance.
Excellent electrical and mechanical properties.
Lead Free Soldering process suitable (TG170 deg C Laminate) |
Computer and Peripheral
Communications
Instrumentation
OA Equipment, etch |
SM750 (TG180)Lead Free High TG Laminate and Prepreg
Lead Free high TG Laminate and Prepreg
Copper Foil: .05 oz to 6.0 oz ( or .018mm to .204 mm)
Thickness 3 mil to 62mil ( or .08 mm to 1.60 mm) |
36 x 48
40 x 48
42 x 48 |
Multifunctional Epoxy
E-Woven Glass
HTE Or RTF Copper |
UV Block and AOI Performance.
Excellent dimensional stability and thickness uniformity.
Superior thermal and chemical resistance.
Excellent electrical and mechanical properties.
Lead Free Soldering process. suitable (TG180 deg C Laminate) |
Computer and Peripheral
Communications
Instrumentation
OA Equipment, etch |
SM-560 Halogen Free Laminate and prepreg
Copper Foil : 0.5 oz to 6.0 oz (0.018 mm to 0.204 mm )
Thickness : 3 mil to 62 mil ( or .08 mm to 1.60 mm ) |
36 x 48
40 x 48
42 x 48 |
Tetra-Functional Epoxy does not contain any halogenated flame retardants
E-woven Glass
THE or RTF Copper Foil |
Halogen and antimony free. Flammability meets UL 94-V-0.
Thermal stability for lead free process.
Excellent long term reliability.
Low C.T.E provide excellent through- hole reliability.
UV Block and AOI Performance |
Computer and Peripheral
Communications
Instrumentation
OA Equipment, etch |
SM-630 High CTI Laminate and Prepreg
Copper Foil : 0.5 oz to 6.0 oz (0.018 mm to 0.204 mm )
Thickness : 3 mil to 125 mil (or .08 mm to 3.20 mm ) |
36 x 48
40 x 48
42 x 48 |
Tetra-Functional Epoxy
E-woven Glass
THE or RTF Copper Foil |
High CTI Value (over 600 V)
UV Block and AOI Performance.
Excellent dimensional stability and thickness uniformity.
Superior thermal and chemical resistances.
Excellent Mechanical and electrical properties. |
Computer and Peripheral
Communications
Instrumentation
OA Equipment, etch
Consumer |
Other sheet sizes available upon request 
